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IC Substrate

The IC carrier board, also known as the packaging substrate, is an indispensable part of the chip packaging process. It mainly provides electronic connections between the chip and the PCB motherboard, playing a role of "connecting the top and the bottom". IC carrier boards have the characteristics of high density, high precision, high performance, miniaturization, and thinning. Their main function is to carry chips, provide support, heat dissipation, and protection for chips, and achieve multi pin, reduced packaging product volume, improved electrical performance and heat dissipation, or multi chip modularization.

Drilling difficulties

The IC board process is similar to PCB, but its wiring density, line width, interlayer alignment, and material reliability standards are higher than those of ordinary PCB boards.
For drilling, the main drilling difficulties include:

High precision requirements for hole positions
Small aperture, difficult to manufacture
Small line width, high requirement for hole accuracy

Hard coating enhances wear resistance and chip removal performance

For the drilling difficulties of IC carrier boards, our company designs drilling needles from the following perspectives:

Reduce the contact between the drill pin and the hole wall, and suppress the frictional heat between the drill pin and the hole wall

Improve positioning performance

Enhance the rigidity of drill needles

Process capability optimization, self-made equipment, ensuring process capability and testing capability

UCN series

Knife shape	Coating	Characteristic
UCN series	Hard coating/lubricating coati	UC+edge cutter design reduces the contact between the drill pin and the hole wall, suppressing cutting heat; The parallel groove design enhances the rigidity of the drill needle.
UCN series	Hard Coating	Good rigidity and chip removal performance, hard coating can effectively suppress wear and greatly improve service life.

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